Kwitekhnoloji yanamhlanje yokubonisa i-elektroniki, umboniso we-LED usetyenziswa ngokubanzi kwiimpawu zedijithali, imvelaphi yeqonga, umhombiso wangaphakathi kunye nezinye iinkalo ngenxa yokukhanya kwayo okuphezulu, ukuchazwa okuphezulu, ubomi obude kunye nezinye iingenelo. Kwinkqubo yokwenziwa komboniso we-LED, itekhnoloji ye-encapsulation iyikhonkco eliphambili. Phakathi kwazo, itekhnoloji ye-SMD encapsulation kunye ne-COB ye-encapsulation itekhnoloji zimbini ezingundoqo ze-encapsulation. Ngoko ke, yintoni umahluko phakathi kwazo? Eli nqaku liza kukunika uhlalutyo olunzulu.
1.yintoni iteknoloji yokupakisha ye-SMD, umgaqo wokupakisha we-SMD
Iphakheji ye-SMD, igama elipheleleyo le-Surface Mounted Device (i-Surface Mounted Device), luhlobo lwamacandelo e-elektroniki adityaniswe ngokuthe ngqo kwibhodi yesekethe eprintiweyo (PCB) iteknoloji yokupakisha umphezulu. Le teknoloji ngomatshini wokubeka ochanekileyo, i-chip ye-LED efihliweyo (ngokuqhelekileyo iqulethe i-LED ukukhanya-emitting diodes kunye namacandelo esekethe ayimfuneko) ibekwe ngokuchanekileyo kwi-pads ye-PCB, kwaye emva koko nge-soldering ye-reflow kunye nezinye iindlela zokuqonda ukupakishwa kombane. Itekhnoloji yenza izinto ze-elektroniki zibe ncinci, zibe khaphukhaphu ngobunzima, kwaye zilungele ukuyilwa kweemveliso ze-elektroniki ezihlangeneyo nezikhaphukhaphu.
2.Izinto eziluncedo kunye nezinto ezingeloncedo kwiTekhnoloji yokuPakisha ye-SMD
2.1 I-SMD Packaging Technology Advantages
(1)ubungakanani obuncinci, ubunzima obulula:Izinto zokupakisha ze-SMD zincinci ngobukhulu, zilula ukudibanisa ubuninzi obuphezulu, zihambelana noyilo lweemveliso ze-elektroniki ezincinci kunye nezikhaphukhaphu.
(2)iimpawu ezintle zefrikhwensi ephezulu:izikhonkwane ezimfutshane kunye neendlela zokudibanisa ezimfutshane zinceda ukunciphisa i-inductance kunye nokuchasana, ukuphucula ukusebenza kwe-high-frequency.
(3)Ilungele imveliso ezenzekelayo:ilungele ukuveliswa komatshini wokubeka ngokuzenzekelayo, ukuphucula ukusebenza kakuhle kwemveliso kunye nokuzinza komgangatho.
(4)Ukusebenza kakuhle kwe-thermal:ukudibana ngqo nomphezulu we-PCB, okulungele ukutshabalalisa ubushushu.
2.2 I-SMD Packaging Technology Disadvantages
(1)ulondolozo oluntsonkothileyo: nangona indlela yokunyusa umgangatho yenza kube lula ukulungisa kunye nokutshintsha amacandelo, kodwa kwimeko yokuhlanganiswa koxinano oluphezulu, ukutshintshwa kwamacandelo ngamanye kunokuba nzima.
(2)Indawo enyiniweyo yokulahla ubushushu:ubukhulu becala ngephedi kunye nejeli yokutshatyalaliswa kobushushu, ixesha elide umsebenzi womthwalo ophezulu unokukhokelela ekugxininiseni ubushushu, okuchaphazela ubomi benkonzo.
3.yintoni iteknoloji yokupakisha yeCOB, umgaqo wokupakisha weCOB
Iphakheji ye-COB, eyaziwa ngokuba yiChip kwiBhodi (i-Chip kwiphakheji yeBhodi), yi-chip engenanto edityaniswe ngokuthe ngqo kwi-PCB yokupakisha iteknoloji. Inkqubo ethile yi-chip engenanto (umzimba we-chip kunye ne-I / O iitheminali kwikristale engentla) kunye ne-conductive okanye i-thermal adhesive edibeneyo kwi-PCB, kwaye emva koko ngocingo (olufana ne-aluminium okanye ucingo lwegolide) kwi-ultrasonic, phantsi kwesenzo. yoxinzelelo lobushushu, iitheminali ze-I/O zechip kunye neepads zePCB ziqhagamshelwe phezulu, kwaye ekugqibeleni zitywinwe ngokhuseleko lokuncamathelisa kwentlaka. Le encapsulation kuphelisa isibane isibane isibane LED amanyathelo encapsulation, ukwenza ipakethe compact ngakumbi.
4.Iinzuzo kunye nokungalunganga kwe-COB yokupakisha iteknoloji
4.1 Iinzuzo zeteknoloji yokupakisha yeCOB
(1) iphakheji edibeneyo, isayizi encinci:ukuphelisa izikhonkwane ezisezantsi, ukufezekisa ubungakanani bephakheji encinci.
(2) ukusebenza okuphezulu:ucingo lwegolide oludibanisa itshiphu kunye nebhodi yesekethe, umgama wokuhanjiswa komqondiso umfutshane, ukunciphisa i-crosstalk kunye ne-inductance kunye neminye imiba yokuphucula ukusebenza.
(3) Ukukhutshwa kakuhle kobushushu:i-chip idityaniswe ngokuthe ngqo kwi-PCB, kwaye ubushushu buchithwa kuyo yonke ibhodi ye-PCB, kwaye ubushushu buchithwa ngokulula.
(4) Ukusebenza kokhuseleko olomeleleyo:uyilo oluvalelwe ngokupheleleyo, olungenamanzi, ubungqina bokufuma, ubungqina bothuli, i-anti-static kunye neminye imisebenzi yokukhusela.
(5) amava amahle okubonwayo:njengomthombo wokukhanya komphezulu, ukusebenza kombala kucace ngakumbi, ukusetyenzwa kweenkcukacha okugqwesileyo, kufanelekile ukujongwa ixesha elide.
4.2 Ukungalungi kwethekhnoloji yokupakishwa kweCOB
(1) ubunzima bokugcina:itshiphu kunye nePCB welding ngqo, ayinakuchithwa ngokwahlukileyo okanye indawo chip, iindleko ukugcinwa ziphezulu.
(2) iimfuno ezingqongqo zemveliso:inkqubo yokupakisha iimfuno zokusingqongileyo iphezulu kakhulu, ayivumeli uthuli, umbane ongatshintshiyo kunye nezinye izinto zongcoliseko.
5. Umahluko phakathi kweteknoloji yokupakisha ye-SMD kunye ne-COB yokupakisha iteknoloji
I-teknoloji ye-SMD ye-encapsulation kunye ne-COB ye-teknoloji ye-encapsulation kwintsimi ye-LED ibonisa nganye ineempawu zayo ezikhethekileyo, umehluko phakathi kwabo ubonakaliswa ngokukodwa kwi-encapsulation, ubukhulu kunye nobunzima, ukusebenza kokutshatyalaliswa kobushushu, ukukhululeka kokugcinwa kunye neemeko zesicelo. Oku kulandelayo luthelekiso oluneenkcukacha kunye nohlalutyo:
5.1 Indlela yokupakisha
⑴Itekhnoloji yokupakisha ye-SMD: igama elipheleleyo sisiXhobo esiFakelweyo kuMphezulu, obubuchwephesha bokupakisha obuthengisa itshiphu ye-LED epakishiweyo kumphezulu webhodi yesekethe eprintiweyo (PCB) ngomatshini ochanekileyo. Le ndlela ifuna ukuba i-chip ye-LED ipakishwe kwangaphambili ukuze yenze icandelo elizimeleyo kwaye ifakwe kwi-PCB.
⑵Itekhnoloji yokupakisha yeCOB: igama elipheleleyo yiChip kwiBhodi, eyitekhnoloji yokupakisha ethengisa ngokuthe ngqo itshiphu engenanto kwiPCB. Iphelisa amanyathelo okupakishwa kwamaso emveli isibane se-LED, ibopha ngokuthe ngqo i-chip engenanto kwi-PCB ngeglue conductive okanye thermal conductive, kwaye iqonda uqhagamshelo lombane ngocingo lwentsimbi.
5.2 Ubungakanani kunye nobunzima
⑴Ukupakishwa kwe-SMD: Nangona iikhomponenti zincinci ngobukhulu, ubungakanani bazo kunye nobunzima zisanqongophele ngenxa yesakhiwo sokupakisha kunye neemfuno zepadi.
⑵Iphakheji yeCOB: Ngenxa yokushiyilwa kwezikhonkwane ezisezantsi kunye neqokobhe lepakethe, iphakheji yeCOB ifezekisa ukubumbana okugqithisileyo, isenza ukuba ipakethe ibe ncinci kwaye ibe khaphukhaphu.
5.3 Ukusebenza kokutshatyalaliswa kobushushu
⑴Ukupakishwa kwe-SMD: Ikakhulu ikhupha ubushushu ngeepads kunye ne-colloids, kwaye indawo yokulahla ubushushu ilinganiselwe. Ngaphantsi kokukhanya okuphezulu kunye neemeko eziphezulu zomthwalo, ukushisa kunokugxilwa kwindawo ye-chip, echaphazela ubomi kunye nokuzinza kwesiboniso.
⑵Iphakheji yeCOB: Itshiphu idityaniswe ngokuthe ngqo kwi-PCB kwaye ubushushu bunokuchithwa kuyo yonke ibhodi yePCB. Olu luyilo luphucula kakhulu ukusebenza kobushushu bomboniso kunye nokunciphisa izinga lokungaphumeleli ngenxa yokushisa okukhulu.
5.4 Uncedo lolondolozo
⑴Ukupakishwa kwe-SMD: Kuba iikhomponenti zixhonywe ngokuzimeleyo kwi-PCB, kulula ukubuyisela icandelo elinye ngexesha lolondolozo. Oku kunceda ekunciphiseni iindleko zokulondoloza kunye nokunciphisa ixesha lokulondoloza.
⑵Ukupakishwa kweCOB: Kuba itshiphu kunye nePCB zidityaniswe ngokuthe ngqo ngokupheleleyo, akunakwenzeka ukuba udibanise okanye ubuyisele itshiphu ngokwahlukeneyo. Xa impazamo yenzekile, kuye kufuneke ukuba kubuyiselwe ibhodi yePCB yonke okanye uyibuyisele kumzi-mveliso ukuze ilungiswe, nto leyo eyandisa iindleko kunye nobunzima bokulungisa.
5.5 Iimeko zesicelo
⑴Ukupakishwa kwe-SMD: Ngenxa yokukhula kwayo okuphezulu kunye nexabiso eliphantsi lemveliso, isetyenziswa kakhulu kwimarike, ngakumbi kwiiprojekthi ezingakhathaliyo kwaye zifuna ukugcinwa lula okuphezulu, okunje ngeebhilibhodi zangaphandle kunye neendonga zeTV zangaphakathi.
⑵Ukupakishwa kweCOB: Ngenxa yokusebenza kwayo okuphezulu kunye nokukhuselwa okuphezulu, ifaneleke ngakumbi kwizikrini zokubonisa zangaphakathi eziphezulu, iziboniso zoluntu, amagumbi okubeka iliso kunye nezinye izigcawu ezineemfuno zomgangatho ophezulu kunye neendawo ezinzima. Ngokomzekelo, kumaziko omyalelo, ii-studios, amaziko amakhulu okuthumela kunye nezinye iindawo apho abasebenzi bebukela isikrini ixesha elide, iteknoloji yokupakisha ye-COB inokubonelela ngamava abonakalayo athambileyo kunye afanayo.
Ukuqukumbela
Itekhnoloji yokupakisha ye-SMD kunye ne-COB itekhnoloji yokupakisha nganye ineenzuzo zayo ezizodwa kunye neemeko zesicelo kwintsimi yezikrini zokubonisa i-LED. Abasebenzisi kufuneka balinganise kwaye bakhethe ngokweemfuno zokwenyani xa bekhetha.
Itekhnoloji yokupakisha ye-SMD kunye netekhnoloji yokupakisha ye-COB ineenzuzo zabo. Itekhnoloji yokupakisha ye-SMD isetyenziswa kakhulu kwimarike ngenxa yokuvuthwa kwayo okuphezulu kunye neendleko eziphantsi zemveliso, ngakumbi kwiiprojekthi ezingabizi kakhulu kwaye zifuna ukulungiswa okuphezulu. Itekhnoloji yokupakisha yeCOB, ngakolunye uhlangothi, inokhuphiswano oluqinileyo kwizikrini zokubonisa zangaphakathi eziphezulu, iziboniso zoluntu, amagumbi okubeka iliso kunye nezinye iindawo kunye nokupakishwa kwayo okudibeneyo, ukusebenza okuphezulu, ukutshatyalaliswa kobushushu obuhle kunye nokusebenza okuqinileyo kokukhusela.
Ixesha lokuposa: Sep-20-2024
